共 50 条
- [33] The formation of MoS2 secondary phase at the Cu—Zn—Sn—S/Mo interface during the sulfurization process of Cu—Zn—Sn precursor films Russian Chemical Bulletin, 2015, 64 : 2586 - 2590
- [40] Influence of Cu content on compound formation near the chip side for the flip-chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump during aging Journal of Electronic Materials, 2006, 35 : 1745 - 1754