A MICROASSEMBLY PROCESS TO REALIZE ANGULAR VERTICAL COMB ELECTRODES FOR A GIMBAL-LESS TWO-AXIS ELECTROSTATIC SCANNER

This paper proposes a microassembly process that easily realizes a gimbal-less two-axis electrostatic MEMS scanner with fixed angular vertical comb electrodes (FAVCs). The fabrication steps can be remarkably reduced by employing a microassembly, as there is no need to add an insulation layer and conduct a multi-step etching process for SVCs. The reduction in the number of fabrication steps also improves the device yield and reduces fabrication errors. The proposed scanner can be readily applied to various optical applications, as the slow axis is driven by quasi-static operation, allowing the amplitude of the scanning angle to remain constant within a specific frequency range.