MEMS and Si micromachined circuits for high-frequency applications

被引:69
|
作者
Katehi, LPB [1 ]
Harvey, JF
Brown, E
机构
[1] Purdue Univ, Sch Engn, W Lafayette, IN 47907 USA
[2] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
[3] Army Res Off, Res Triangle Pk, NC 27709 USA
[4] Univ Calif Los Angeles, Los Angeles, CA 90095 USA
关键词
high-frequency circuits; on-wafer packaging; RF MEMS; Si micromachining; three-dimensional integration;
D O I
10.1109/22.989969
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits.
引用
收藏
页码:858 / 866
页数:9
相关论文
共 50 条
  • [21] Design of Spring Coupling for High-Q High-Frequency MEMS Filters for Wireless Applications
    Shalaby, Mohammed M.
    Abdelmoneum, Mohamed A.
    Saitou, Kazuhiro
    [J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2009, 56 (04) : 1022 - 1030
  • [22] Behavioral Comparison of Si and SiC Power MOSFETs for High-Frequency Applications
    Chen, Zheng
    Boroyevich, Dushan
    Li, Jin
    [J]. 2013 TWENTY-EIGHTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2013), 2013, : 2453 - 2460
  • [23] Optimization of Reconfigurable Si NW FETs for Analog High-Frequency Applications
    Darbandy, Ghader
    Schroeter, Michael
    Claus, Martin
    [J]. 2016 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD), 2016, : 245 - 248
  • [24] Integrated CMOS-MEMS with on-chip readout electronics for high-frequency applications
    Verd, J.
    Uranga, A.
    Teva, J.
    Lopez, J. L.
    Torres, F.
    Esteve, J.
    Abadal, G.
    Perez-Murano, F.
    Barniol, N.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2006, 27 (06) : 495 - 497
  • [25] A micro-LC-resonator fabricated by MEMS technique for high-frequency sensor applications
    Le, Anh-Tuan
    Cho, Wan-Shik
    Kim, Yong-Seok
    Lee, Jeong-Bong
    Kim, Chong-Oh
    Lee, Heebok
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2007, 135 (02) : 547 - 551
  • [26] HIGH-FREQUENCY DIELECTRICS AND THEIR APPLICATIONS
    WAKINO, K
    [J]. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 1986, 33 (06) : 802 - 802
  • [27] Applications of high-frequency radar
    Headrick, JM
    Thomason, JF
    [J]. RADIO SCIENCE, 1998, 33 (04) : 1045 - 1054
  • [28] PIEZOCERAMICS FOR HIGH-FREQUENCY APPLICATIONS
    UEDA, I
    NISHIDA, M
    OUCHI, K
    KHAYAKAVA, S
    [J]. IZVESTIYA AKADEMII NAUK SSSR SERIYA FIZICHESKAYA, 1977, 41 (04): : 707 - 714
  • [29] A CMOS micromachined capacitive tactile sensor with high-frequency output
    Ko, Cheng-Ting
    Tseng, Sheng-Hsiang
    Lu, Michael S. -C.
    [J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2006, 15 (06) : 1708 - 1714
  • [30] High-frequency piezoelectric PZT film micromachined ultrasonic transducers
    Zhou, Q. F.
    Wu, D.
    Djuth, F. T.
    Liu, C. G.
    Shung, K. K.
    [J]. 2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6, 2007, : 1057 - +