The Heat Transfer Performance of the Carbon Nano-Tubes Micro-Channel Cooler in 3-D Stacked Package

被引：0
|
作者：
Qi, Gaoan [1 ]
Huang, Min [1 ]
Wang, Xiaojing [1 ]
Wu, Bing [1 ]
Zang, Chunyang [1 ]
Wang, Dianxiao [1 ]
机构：
[1] Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai 20072, Peoples R China
来源：
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年
关键词：
Numerical simulations; Heat dispersion performance; CNT micro-channel Cooler; 3-D Stacked Package; TECHNOLOGY;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, several kinds of numerical simulations of three-dimensional stacked package with different microchannel coolers have been carried out to compare the heat dispersion performance. By setting different parameters of inlet flow and the power of two chips, it shows that: The overall temperature of 3-D stacked package with prism array microchannel is lowest of all at the same rate of flow and power. The 3-D stacked package with prism array CNT's microchannel cooler has been found to have the best heat dispersion performance.
引用
收藏
页码：848 / 852
页数：5
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