Reliability Prediction for IGBT Solder Joints Using Clech Algorithm

被引：0

作者：

Lu, Hua ^{[1
]}

Bailey, Chris ^{[1
]}

机构：

[1] Univ Greenwich, Epartment Math Sci, 30 Pk Row, London SE10 9LS, England

来源：

2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年

基金：

英国工程与自然科学研究理事会;

关键词：

Clech Algorithm; formatting; IGBT; solder joint; Finite Element;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The Clech Algorithm is an approximate method for the prediction of the stress state and damage of solder joints of electronics components such as Flipchip, Ball Grid Array that are undergone time dependent temperature load. It can be used to predict the reliability of solder joint under temperature cycling conditions. In this work, the application of this algorithm has been described and applied to predict the stress/strain and plastic work density in IGBT solder joints. The results are compared with 2D Finite Element analysis and it is concluded that the Clech Algorithm can be used for reliability prediction of IGBT solder joint.

引用

页码：1059 / 1063

页数：5

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