The unique properties of SiCN as bonding material for hybrid bonding

被引：9
|
作者：
Iacovo, Serena [1 ]
Kim, Soon-Wook [1 ]
Nagano, Fuya [1 ]
Peng, Lan [1 ]
Inoue, Fumihiro [1 ]
Phommahaxay, Alain [1 ]
Beync, Eric [1 ]
机构：
[1] IMEC, Leuven, Belgium
来源：
2021 7TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2021年
关键词：
D O I：
10.1109/LTB-3D53950.2021.9598192
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Direct Cu-SiCN hybrid bonding is successfully realized by using a thermal budget of 250 degrees C. The excellent results should be attributed to the tight control on the different processing steps but also to the properties of the SiCN dielectric used as bonding material.
引用
收藏
页码：38 / 38
页数：1
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