Thermal math modeling and analysis of an electronic assembly

被引：1
|
作者：
Shukla, KN [1 ]
机构：
[1] Vikram Sarabhai Space Ctr, Trivandrum 695022, Kerala, India
来源：
JOURNAL OF ELECTRONIC PACKAGING | 2001年 / 123卷 / 04期
关键词：
D O I：
10.1115/1.1388561
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a mathematical model for a three-dimensional thermal analysis of a circuit board with multiple heat dissipating sources. The model considers the three-dimensional flat plate with discrete surface heat sources and integral transform technique is employed to determine the temperature distribution. The Calculation procedure for the thermal characteristics of a circuit board, with surface mounted components, is presented and thesolution is compared with those obtained.front thefinite element method. Also, the temperature distribution of a two-layered circuit board is presented in terms of Greens function.
引用
收藏
页码：372 / 378
页数：7
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