Thermal debinding mechanism of metal injection molding compacts in vacuum

被引：0
|
作者：
Liu, SJ [1 ]
Huang, BY [1 ]
Qu, XH [1 ]
Zhong, XX [1 ]
Yan, WH [1 ]
Li, YM [1 ]
机构：
[1] Cent S Univ Technol, State Key Lab Powder Met, Changsha 410083, Peoples R China
来源：
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 1999年 / 9卷 / 02期
关键词：
powder injection molding; vacuum; thermal debinding;
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The processing of the thermal debinding in vacuum using water atomized 316L stainless steel powder and wax-based multicomponent binder were systemically studied. The thermal debinding velocity in vacuum was analyzed under the conditions of different binders and different rising temperature rates, especially the low temperature thermal debinding kinetics in vacuum. The processing of thermal debinding in the flowing H-2 was also compared with the processing in vacuum. The binder removal rate in vacuum was faster than that in the flowing H-2, but the control of defect is more difficult. The reason was that the gas pressure in the green parts was higher than that in environment.
引用
收藏
页码：338 / 341
页数：4
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