Multilayer assemblies of poly(4-vinylpyridine) bearing an osmium complex and poly(acrylic acid) via hydrogen bonding

被引:0
|
作者
Wang, LY [1 ]
Fu, Y [1 ]
Wang, ZQ [1 ]
Wang, Y [1 ]
Sun, CQ [1 ]
Fan, YG [1 ]
Zhang, X [1 ]
机构
[1] Jilin Univ, Dept Chem, Key Lab Supramol Struct & Spect, Changchun 130023, Peoples R China
关键词
D O I
10.1002/(SICI)1521-3935(19990601)200:6<1523::AID-MACP1523>3.0.CO;2-6
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Poly(4-vinylpyridine) bearing an osmium complex was alternately assembled with poly(acrylic acid) on a gold substrate via hydrogen bonding. W-Vis spectra were used to monitor the assembling process. X-ray diffraction patterns and AFM images showed that the multilayer film is of high quality with low surface roughness. The properties of electrodes modified with such a film were characterized by means of cyclic voltammograms, which strongly depended on the architecture of the layered assembly.
引用
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页码:1523 / 1527
页数:5
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