Microfluidic chip fabrication for silicon mold insert by micro hot embossing

被引：0

作者：

Shih, Yung-Hsun ^{[1
,2
]}

Shen, Yung-Kang ^{[3
]}

Lin, Yi ^{[4
]}

Lee, Jeou-Long ^{[5
]}

Lin, Chon-Ta ^{[5
]}

Lee, Chien-Pang ^{[5
]}

Wu, Ming-Wei ^{[6
]}

机构：

[1] Taipei Med Univ, Coll Oral Med, Sch Dent, Taipei 110, Taiwan

[2] Taipei Med Univ, Dent Dept Wan Fang Hosp, Taipei 110, Taiwan

[3] Taipei Med Univ, Coll Oral Med, Sch Dent Technol, Nano Micro Forming Lab, Taipei 110, Taiwan

[4] Takming Univ Sci & Technol, Dept Business Adm, Taipei 114, Taiwan

[5] LungHwa Univ Sci & Technol, Grad Sch Engn & Technol, Taoyuan 333, Taiwan

[6] LungHwa Univ Sci & Technol, Dept Engn Mech, Taoyuan 333, Taiwan

来源：

2008 3RD IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1-3 | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

引用

页码：690 / +

页数：2

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