Polymer Micro Hot Embossing with Bulk Metallic Glass Mold Insert

被引:4
|
作者
Zhang Xiang [1 ,3 ,5 ]
Ma Jiang [2 ]
Bai Ran [4 ]
Li Qian [3 ,5 ]
Sun Bingli [3 ,5 ]
Shen Changyu [3 ,5 ]
机构
[1] Zhengzhou Univ, Sch Mech Engn, Zhengzhou 450001, Peoples R China
[2] Chinese Acad Sci, Inst Phys, Beijing 100190, Peoples R China
[3] Henan Key Lab Micro Molding Technol, Zhengzhou 450002, Peoples R China
[4] Henan Mech & Elect Vocat Coll, Zhengzhou 451191, Peoples R China
[5] Zhengzhou Univ, Natl Engn Res Ctr Adv Polymer Proc Technol, Zhengzhou 450002, Peoples R China
关键词
Hot embossing; Bulk metallic glass; Polymer microstructure; Micro mold insert;
D O I
10.4028/www.scientific.net/AMR.510.639
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Polymer microstructures are used more and more in many fields. Hot embossing is one of molding processing to achieve micro polymer components. In this paper, bulk metallic glass was selected as mold material to fabricate mold insert of micro hot embossing. Traditional UV-lithography and ICP-etching were used to achieve micro features on silicon wafer. And then, micro features were transferred from silicon wafer to bulk metallic glass mold insert above its glass transition temperature. Finally, applied bulk metallic glass mold insert to replicate polymer microstructure with hot embossing. Three commonly used thermoplastic polymers: high-density polyethylene (HDPE), polypropylene (PP) and polycarbonate (PC) were selected in this study Experiments show that microstructures can have a good replication from bulk metallic glass mold insert to the thermoplastic polymer using hot embossing.
引用
收藏
页码:639 / +
页数:2
相关论文
共 50 条
  • [1] Metallic glass mold insert for hot embossing of polymers
    Ma, J.
    Zhang, X.
    Wang, W. H.
    [J]. JOURNAL OF APPLIED PHYSICS, 2012, 112 (02)
  • [2] High-Accuracy Bulk Metallic Glass Mold Insert for Hot Embossing of Complex Polymer Optical Devices
    Liu, Xue
    Shao, Yang
    Lu, Si-Yuan
    Yao, Ke-Fu
    [J]. JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 2015, 53 (07) : 463 - 467
  • [3] Polymer micro molding with bulk metallic glass mold
    Xiang Zhang
    Jiang Ma
    Ge Fang
    Bingli Sun
    Junfeng Li
    Qian Li
    [J]. Microsystem Technologies, 2015, 21 : 1453 - 1457
  • [4] Polymer micro molding with bulk metallic glass mold
    Zhang, Xiang
    Ma, Jiang
    Fang, Ge
    Sun, Bingli
    Li, Junfeng
    Li, Qian
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (07): : 1453 - 1457
  • [5] Hot embossing of micro-lens array on bulk metallic glass
    Pan, C. T.
    Wu, T. T.
    Chen, M. F.
    Chang, Y. C.
    Lee, C. J.
    Huang, J. C.
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2008, 141 (02) : 422 - 431
  • [6] Microfluidic chip fabrication for silicon mold insert by micro hot embossing
    Shih, Yung-Hsun
    Shen, Yung-Kang
    Lin, Yi
    Lee, Jeou-Long
    Lin, Chon-Ta
    Lee, Chien-Pang
    Wu, Ming-Wei
    [J]. 2008 3RD IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1-3, 2008, : 690 - +
  • [7] Replication of micro/nano-scale features by micro injection molding with a bulk metallic glass mold insert
    Zhang, N.
    Chu, J. S.
    Byrne, C. J.
    Browne, D. J.
    Gilchrist, M. D.
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 22 (06)
  • [8] REPLICATION OF NANO/MICRO QUARTZ MOLD BY HOT EMBOSSING AND ITS APPLICATION TO BOROSILICATE GLASS EMBOSSING
    Youn, Sung-Won
    Okuyama, Chieko
    Takahashi, Masharu
    Maeda, Ryutaro
    [J]. ENGINEERING PLASTICITY AND ITS APPLICATIONS: FROM NANOSCALE TO MACROSCALE, 2009, : 746 - 751
  • [9] REPLICATION OF NANO/MICRO QUARTZ MOLD BY HOT EMBOSSING AND ITS APPLICATION TO BOROSILICATE GLASS EMBOSSING
    Youn, Sung-Won
    Okuyama, Chieko
    Takahashi, Masharu
    Maeda, Ryutaro
    [J]. INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2008, 22 (31-32): : 6118 - 6123
  • [10] Experiment and simulation of hot embossing of a bulk metallic glass with low pressure and temperature
    Pan, C. T.
    Wu, T. T.
    Chang, Y. C.
    Huang, J. C.
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 18 (02)