The Investigation of Plating Technologies for Front Fingers of c-Si Solar Cells

被引:0
|
作者
Sun, Shiyang [1 ]
Long, Jianping [1 ]
Zhang, Bo [2 ]
机构
[1] Chengdu Univ Technol, Coll Mat & Chem & Chem Engn, Chengdu 610059, Peoples R China
[2] Univ Elect Sci & Technol China, Sch Energy Sci & Engn, Chengdu 611731, PR, Peoples R China
来源
关键词
solar cell; metallization; electroless plating; electroplating; photoplating; METALLIZATION; COPPER;
D O I
10.4028/www.scientific.net/AMR.512-515.198
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Besides silicon wafers, the metallization of solar cells is the most expensive process in the mass production of solar cells nowadays. Therefore, the development of cost-effective metallization technologies is very important for the reduction of manufacturing cost. In this article, we will introduce two novel approaches for the metallization of c-Si solar cells: (i) electroless plated Ni and electroplated Cu; (ii) photoplated Ni and Cu. It is believed that high efficiency and low cost solar cells can be fabricated taking advantages of the improved metallization methods.
引用
收藏
页码:198 / +
页数:2
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