Modeling of Delamination in IC Packages

被引：0
|
作者：
Tay, Andrew A. O. [1 ]
机构：
[1] Natl Univ Singapore, Dept Mech Engn, Singapore, Singapore
来源：
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
When plastic-encapsulated packages undergo solder reflow after being subjected to moisture preconditioning, hygrothermal stresses are induced in the package. If these stresses are excessive popcorning failure will occur. It has been shown that popcorning failure is usually preceeded by delamination of interfaces in the package. The fracture mechanics approach has been successfully applied by the author to analyse 20 and 3D delaminations in plastic-encapsulated IC packages. In this paper, the author will review some case studies and key findings.
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页码：853 / 859
页数：7
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