Compact Multimode Polymer Waveguide Bends for Board-Level Optical Interconnects

被引:16
|
作者
Bamiedakis, Nikolaos [1 ]
Penty, Richard V. [1 ]
White, Ian H. [1 ]
机构
[1] Univ Cambridge, Dept Engn, Elect Engn Div, Cambridge CB3 0FA, England
基金
英国工程与自然科学研究理事会;
关键词
Board-level optical interconnects; multimode waveguide bends; polymer waveguides; COST;
D O I
10.1109/JLT.2013.2265774
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Multimode polymer waveguides are promising for use in board-level optical interconnects. In recent years, various on-board optical interconnection architectures have been demonstrated making use of passive routing waveguide components. In particular, 90 bends have played important roles in complex waveguide layouts enabling interconnection between non co-linear points on a board. Due to the dimensions and index step of the waveguides typically used in on-board optical interconnects, low-loss bends are typically limited to a radius of similar to 10 mm. This paper therefore presents the design and fabrication of compact low-loss waveguide bends with reduced radii of curvature, offering significant reductions in the required areas for on-board optical circuits. The proposed design relies on the exposure of the bend section to the air, achieving tighter light confinement along the bend and reduced bending losses. Simulation studies carried out with ray tracing tools and experimental results from polymer samples fabricated on FR4 are presented. Low bending losses are achieved from the air-exposed bends up to 4 mu m of radius of curvature, while an improvement of 14 m in the 1 dB alignment tolerances at the input of these devices (fibre to waveguide coupling) is also obtained. Finally, the air-exposed bends are employed in an optical bus structure, offering reductions in insertion loss of up to 3.8 dB.
引用
收藏
页码:2370 / 2375
页数:6
相关论文
共 50 条
  • [11] Facile fabrication and optical properties of polymer waveguides with smooth surface for board-level optical interconnects
    Liu, Xiao-Feng
    Wang, Rui
    Wang, Guo-Dong
    Yao, Teng-Feng
    Miao, Hua
    Sun, Rong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 33 (34) : 26025 - 26039
  • [12] Facile fabrication and optical properties of polymer waveguides with smooth surface for board-level optical interconnects
    Xiao-Feng Liu
    Rui Wang
    Guo-Dong Wang
    Teng-Feng Yao
    Hua Miao
    Rong Sun
    Journal of Materials Science: Materials in Electronics, 2022, 33 : 26025 - 26039
  • [13] Prospects of a polymer-waveguide-based board-level optical interconnect technology
    Dangel, R.
    Berger, C.
    Beyeler, R.
    Dellmann, L.
    Horst, F.
    Lamprecht, T.
    Meier, N.
    Offrein, B. J.
    2007 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2007, : 131 - 134
  • [14] Integrated waveguide microoptic elements for 3D routing in board-level optical interconnects
    Glebov, Alexei L.
    Lee, Michael G.
    Aoki, Shigenori
    Kudzuma, David
    Roman, James
    Peters, Michael
    Huang, Lidu
    Zhou, D. Steve
    Yokouchi, Kishio
    PHOTONICS PACKAGING AND INTEGRATION VI, 2006, 6126
  • [15] Multichannel optical link based on polymer multimode waveguides for board-level interchip communication
    Nieweglowski, Krzysztof
    Lorenz, Lukas
    Wolter, Klaus-Juergen
    Bock, Karlheinz
    2015 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2015,
  • [16] Design, Fabrication and Connectorization of High-Performance Multimode Glass Waveguides for Board-Level Optical Interconnects
    Brusberg, Lars
    Fortusini, Davide D.
    Schroeder, Henning
    Jiang, Wei C.
    Zakharian, Aramais R.
    Kuchinsky, Sergey A.
    Fiebig, Christian
    Li, Shenping
    Kobyakov, Andrey
    Evans, Alan F.
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1592 - 1599
  • [17] 160 Gb/s Bidirectional Polymer-Waveguide Board-Level Optical Interconnects Using CMOS-Based Transceivers
    Doany, Fuad E.
    Schow, Clint L.
    Baks, Christian W.
    Kuchta, Daniel A.
    Pepeljugoski, Petar
    Schares, Laurent
    Budd, Russell
    Libsch, Frank
    Dangel, Roger
    Horst, Folkert
    Offrein, Bert J.
    Kash, Jeffrey A.
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (02): : 345 - 359
  • [18] Optimization and Characterization of Flexible Polymeric Optical Waveguide Fabrication Process for Fully Embedded Board-level Optical Interconnects
    Shiah, Lim Li
    Teo, Calvin
    Yee, Hong Lor
    Wei, Tan Chee
    Chai, Joey
    Jie, Yap Guan
    Guan, Lim Teck
    Ramana, P. V.
    Lau, John H.
    Chang, Raymond
    Chang, Henry
    Tang, Tom
    Chiang, Steve
    Cheng, David
    Tseng, T. J.
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 1114 - +
  • [19] Flexible optical waveguide film fabrications and optoelectronic devices integration for fully embedded board-level optical interconnects
    Choi, CC
    Lin, L
    Liu, YJ
    Choi, JH
    Wang, L
    Haas, D
    Magera, J
    Chen, RT
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 2004, 22 (09) : 2168 - 2176
  • [20] Flexible Polymer Optical Layer for Board-Level Optical Interconnects by Highly Durable Metal Imprinting Method
    Wang, Xiaolong
    Dou, Xinyuan
    Lin, Xiaohui
    Chen, Ray T.
    OPTOELECTRONIC INTERCONNECTS AND COMPONENT INTEGRATION IX, 2010, 7607