Hybrid integration for silicon photonics applications

被引：13

作者：

Grenouillet, L. ^{[1
]}

Dupont, T. ^{[1
]}

Philippe, P. ^{[1
]}

Harduin, J. ^{[1
]}

Olivier, N. ^{[1
]}

Bordel, D. ^{[1
]}

Augendre, E. ^{[1
]}

Gilbert, K. ^{[1
]}

Grosse, P. ^{[1
]}

Chelnokov, A. ^{[1
]}

Fedeli, J. M. ^{[1
]}

机构：

[1] CEA, LETI, F-38054 Grenoble 9, France

来源：

OPTICAL AND QUANTUM ELECTRONICS | 2012年 / 44卷 / 12-13期

关键词：

Silicon photonics; Hybrid integration; Hybrid lasers; Microdisk laser; Distributed feedback laser; Photodetector; Wavelength division multiplexing applications; Optical network on chip; OPTICAL INTERCONNECT; MICRODISK LASERS; CHIP;

D O I：

10.1007/s11082-012-9574-z

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper we show how III-V semiconductors can benefit from advanced silicon fabrication processes and comply with their environment in particular to achieve electrically pumped III-V on silicon lasers for both intra-chip and off-chip applications.

引用

页码：527 / 534

页数：8

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