Early Detection of Systematic Patterning Problems for a 22nm SOI Technology using E-Beam Hot Spot Inspection

被引：0

作者：

Patterson, Oliver D. ^{[1
]}

Ryan, Deborah A. ^{[1
]}

Monkowski, Mike D. ^{[1
]}

Dominique Nguyen-Ngoc ^{[1
]}

Morgenfeld, Bradley ^{[1
]}

Lee, Chung-ham ^{[2
]}

Liu, Chieh-hung ^{[2
]}

Chen, Chi-ming ^{[2
]}

Chen, Shih-tsung ^{[2
]}

机构：

[1] IBM Semicond Res & Dev Ctr, 2070 Route 52,Mail Stop 46H, Hopewell Jct, NY 12533 USA

[2] Hermes Microvis Inc, Poughkeepsie, NY 12601 USA

来源：

2013 24TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2013年

关键词：

Hot spot inspection; E-beam inspection; ORC; OPC; pattern fidelity;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Early detection of systematic patterning problems can provide a major boost for a technology team. Often in the past, these type defects might only be detected after functional test and subsequent failure analysis. At this point, three to six months of process development time have been lost and three to six months of defective hardware have been wasted. In this paper, a methodology for in-line detection of systematic patterning problems using E-beam hot spot inspection (EBHI) is introduced. Pattern simulation tools and other sources are used to recommend X, Y locations with challanging geometries for evaluation. EBHI evaluates the patterning capability for these locations using modulated wafers. A multifunction team addresses the hot spots that fail within the process window. EBHI is then used to evaluate the solutions proposed by this team. Often additional data is necessary to determine the full yield impact. This methodology provided tremendous value for IBM's 22nm SOI Technology. Several examples illustrating this point are presented.

引用

页码：295 / 300

页数：6

共 20 条

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