The Key Problems in the Manufacturing of the Bamboo Buffer Packaging Material

被引:0
|
作者
Liu, Ye [1 ]
Qi, ShuYan [1 ]
Shi, ZhengYing [1 ]
机构
[1] Zhejiang Sci Tech Univ, Packaging Engn Dept, Hangzhou 310018, Zhejiang, Peoples R China
关键词
Bamboo pulp; Surface treatment; Cushioning performance; Foaming mechanism; Cell structure; Foaming techniques; Bamboo buffer packaging material;
D O I
10.4028/www.scientific.net/AMR.306-307.1585
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper,bamboo pulp was chosen as the raw material on the basis of the researching on the structure and properties of the resource-rich bamboo fibers, the foaming material using the bamboo pulp and other assistants were obtained. It developed bamboo's new applied area and supplied the cushioning industry with a new choice. The best reagent and the optimal ratio of the various components have been identified by the quality evaluation system. Studied on the high efficiency and no polluting foaming mechanism to determine the parameter of foaming technics. Determined the interior adhesive and exterior disposal Conducted the structural analysis and mechanical properties testing, and in compare with the performance of common cushioning material,we know that: Material has a certain buffer performance and for the packing of the products with small shock fragility.
引用
收藏
页码:1585 / 1588
页数:4
相关论文
共 50 条
  • [31] Engineered bamboo as a building material
    Paudel, S. K.
    [J]. MODERN BAMBOO STRUCTURES, 2008, : 33 - 40
  • [32] Comparison of the Suitability of Ci Bamboo and Moso Bamboo for Manufacturing Bamboo-based Fiber Composites
    Yu, Yang-lun
    Zhang, Ya-mei
    Yu, Wen-ji
    Fei, Ben-hua
    Liu, Huan-rong
    [J]. 2012 INTERNATIONAL CONFERENCE ON BIOBASE MATERIAL SCIENCE AND ENGINEERING (BMSE), 2012, : 69 - 74
  • [33] Manufacturing and utilization of bamboo flat board
    Toya, R
    Yamazumi, T
    Yamanouchi, K
    Yonekura, M
    [J]. 5TH WORLD CONFERENCE ON TIMBER ENGINEERING, VOL 2, PROCEEDINGS, 1998, : 282 - 287
  • [34] MATERIAL HANDLING AND PACKAGING
    不详
    [J]. CHEMICAL ENGINEERING WORLD, 1995, 30 (05): : 13 - 13
  • [35] PACKAGING MATERIAL TESTING
    不详
    [J]. VERPACKUNGS RUNDSCHAU, 1980, 31 (01): : 17 - 17
  • [36] MATERIAL ADVANCES IN PACKAGING
    GODDARD, R
    [J]. MATERIALS WORLD, 1994, 2 (12) : 621 - 622
  • [37] PACKAGING MATERIAL IS NOT EXPENSIVE
    CHILCOATE, EF
    [J]. HOSPITALS, 1976, 50 (14): : 40 - 40
  • [38] Packaging material converter
    不详
    [J]. BIOCYCLE, 1998, 39 (01) : 88 - 88
  • [39] Economical manufacturing of thermoformed packaging
    Hartmann, Karl-Hans
    [J]. IPE. Industrial & production engineering, 1988, 12 (03):
  • [40] Microsystems: Manufacturing and packaging challenges
    Mehalso, RM
    [J]. PROCEEDINGS OF THE FOURTEENTH ANNUAL MEETING OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1999, : 33 - 36