Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder

Heat resistant conductive adhesives composed of a multi-functional epoxy matrix containing Ag flakes were developed in this work. The adhesives are potentially stable up to 200-250 degrees C because the primary relaxation mechanism of the matrix resin occurs at similar to 250 degrees C. However, the adhesives appeared to exhibit another relaxation mechanism at an intermediate temperature range (100-180 degrees C) when a mono-epoxide was added to the mixture as the reactive diluent. Adhesives cured under appropriate curing conditions exhibited relatively low electrical resistivity and high thermal conductivity in the in-plane direction. Because the reactive diluent influences the electrical and thermal properties as well as the then-no-mechanical properties of the adhesives, the selection of the most appropriate reactive diluent will be the key to developing conductive adhesives that exhibit superior heat resistance.