Dielectric characteristics of spin-coated dielectric films using on-wafer parallel-plate capacitors at microwave frequencies

被引:0
|
作者
Al-Omari, AN [1 ]
Lear, KL [1 ]
机构
[1] Colorado State Univ, Dept Elect & Comp Engn, Ft Collins, CO 80523 USA
关键词
dielectric permittivity; dielectric loss; tangential loss; polymer films; polyimide; bisbenzcyclobutene (BCB); spin-on glass (SOG); Debye model; Cole-Cole model; pad capacitance;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Dielectric properties of spin-coated dielectric insulators suitable for high-speed device fabrication are investigated. Complex dielectric permittivities and tangential losses of two polyimides, bisbenzocyclobutene (BCB), and a spin-on-glass (SOG) were extracted from the measured microwave reflection coefficient, S-11, of parallel-plate capacitors over a frequency range of 50 MHz to 40 GHz. A model for the dielectric permittivity as a function of frequency is developed based on measured data with a minimum square error of less than 10(-4) between measured and modeled microwave reflection coefficients. A circuit model for the pad capacitance is obtained based on geometrical and physical considerations. The relationship between the dielectric loss and its thickness is considered. Experimental results are fitted to Debye and Cole-Cole models.
引用
收藏
页码:1151 / 1161
页数:11
相关论文
共 46 条
  • [21] Shielding evaluation method for microwave and millimeter waves by parallel-plate guide with center dielectric rod
    Hatakeyama, K
    Togawa, H
    ELECTRONICS AND COMMUNICATIONS IN JAPAN PART I-COMMUNICATIONS, 1997, 80 (03): : 89 - 98
  • [22] Pyroelectric and dielectric properties of spin-coated thin films of vinylidene fluoride-trifluoroethylene copolymers
    Akcan, MI
    Topacli, C
    POLYMER INTERNATIONAL, 2001, 50 (07) : 835 - 840
  • [23] Influence of Zr Doping on Electrical and Dielectric Properties of Spin-Coated Hafnia Films for CMOS Applications
    Sabhya, Dhananjaya
    Kekuda, Dhananjaya
    Rao, K. Mohan
    JOURNAL OF ELECTRONIC MATERIALS, 2025, 54 (03) : 2471 - 2483
  • [24] INTEGRAL CHARACTERISTICS OF A FINITE ARRAY OF PARALLEL-PLATE WAVE-GUIDES LOADED WITH DIELECTRIC PLUGS
    MANUILOV, BD
    YAKOVENKO, VA
    IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII RADIOELEKTRONIKA, 1985, 28 (02): : 34 - 39
  • [25] Error in surface resistance originating from the dielectric loss of the parallel-plate dielectric resonator using the two-resonators method
    Kusunoki, M
    Nishikawa, H
    Hontsu, S
    PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2004, 412 : 1524 - 1527
  • [26] INVESTIGATION ON THE CHARACTERISTICS OF DIELECTRIC BARRIER DISCHARGE IN METHANE WITH PARALLEL-PLATE AND MULTI NEEDLE-PLATE ELECTRODE IN LOW PRESSURE
    Mu, P. Li H. B.
    Yu, C. Y.
    Yao, C. W.
    Xu, G. M.
    Chen, S. L.
    Zhang, G. J.
    2016 43RD IEEE INTERNATIONAL CONFERENCE ON PLASMA SCIENCE (ICOPS), 2016,
  • [27] Modification of Hydrophilic Property of Polypropylene Films by a Parallel-Plate Nitrogen-Based Dielectric Barrier Discharge Jet
    Chiang, Ming-Hung
    Liao, Kuo-Chi
    Lin, I-Min
    Lu, Chi-Chang
    Huang, Hao-Yuan
    Kuo, Chi-Liang
    Wu, Jong-Shinn
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2010, 38 (06) : 1489 - 1498
  • [28] Prediction of ultraviolet-induced damage during plasma processes in dielectric films using on-wafer monitoring techniques
    Ishikawa, Y
    Katoh, Y
    Okigawa, M
    Samukawa, S
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2005, 23 (06): : 1509 - 1512
  • [29] Spin-coated periodic mesoporous organosilica thin films - Towards a new generation of low-dielectric-constant materials
    Hatton, BD
    Landskron, K
    Whitnall, W
    Perovic, DD
    Ozin, GA
    ADVANCED FUNCTIONAL MATERIALS, 2005, 15 (05) : 823 - 829
  • [30] Inkjet Printed Parallel Plate Capacitors Using PVP Polymer Dielectric Ink on Flexible Polyimide Substrates
    Mohapatra, Ankita
    Tuli, Sayema K.
    Liu, Kwei-Yu
    Fujiwara, Tomoko
    Hewitt, Robert W., Jr.
    Andrasik, Frank
    Morshed, Bashir, I
    2018 40TH ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY (EMBC), 2018, : 4277 - 4280