Fracture design of metallic matrix crack for bi-materials

被引：4
|
作者：
Li, YT [1 ]
Yan, CF [1 ]
机构：
[1] Lanzhou Univ Technol, Coll Mechano Elect Engn, Lanzhou 730050, Peoples R China
来源：
FRACTURE AND STRENGTH OF SOLIDS VI, PTS 1 AND 2 | 2006年 / 306-308卷
关键词：
fracture; matrix crack; metallic materials; dynamics;
D O I：
10.4028/www.scientific.net/KEM.306-308.7
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The fracture designs of metallic matrix crack for bi-materials were studied. The stress field and displacement field of plane matrix crack was setup at first. Then the finite element method is used to analyses the stress singularity of matrix cracks between different materials. The solutions of stress singularity of a cracked bi-materials beam under uniform tension, and the three-point bending of bi-materials specimen were computed. The result lays a theoretic and applied foundation for the practical engineering application of metallic matrix crack for bi-materials.
引用
收藏
页码：7 / 12
页数：6
相关论文
共 50 条
  • [21] Dynamic Performance at Inner Tip of an Interfacial Crack near a Circular Cavity in Piezoelectric Bi-Materials
    Song, TianShu
    Hassan, Ahmed
    MATERIALS SCIENCE AND PROCESSING, ENVIRONMENTAL ENGINEERING AND INFORMATION TECHNOLOGIES, 2014, 665 : 30 - 36
  • [22] Equilibrium state of mode-I sub-interfacial crack growth in bi-materials
    Z. Zhuang
    B. B. Cheng
    International Journal of Fracture, 2011, 170 : 27 - 36
  • [23] Elastic-plastic analysis of interaction between an interfacial crack and a subinterfacial microcrack in bi-materials
    Belhouari, M.
    Gouasmi, S.
    bouladjra, B. Bachir
    Kaddouri, K.
    Serier, B.
    COMPUTATIONAL MATERIALS SCIENCE, 2008, 43 (04) : 924 - 929
  • [24] Equilibrium state of mode-I sub-interfacial crack growth in bi-materials
    Zhuang, Z.
    Cheng, B. B.
    INTERNATIONAL JOURNAL OF FRACTURE, 2011, 170 (01) : 27 - 36
  • [25] Transient dynamic interface crack analysis in magnetoelectroelastic bi-materials by a time-domain BEM
    Lei, Jun
    Zhang, Chuanzeng
    Tinh Quoc Bui
    EUROPEAN JOURNAL OF MECHANICS A-SOLIDS, 2015, 49 : 146 - 157
  • [26] Time-domain BEM for transient interfacial crack problems in anisotropic piezoelectric bi-materials
    Jun Lei
    Chuanzeng Zhang
    International Journal of Fracture, 2012, 174 : 163 - 175
  • [27] Interfacial crack-tip constraints and J-integrals in plastically mismatched bi-materials
    Lee, H
    Kim, YJ
    ENGINEERING FRACTURE MECHANICS, 2001, 68 (08) : 1013 - 1031
  • [28] Time-domain BEM for transient interfacial crack problems in anisotropic piezoelectric bi-materials
    Lei, Jun
    Zhang, Chuanzeng
    INTERNATIONAL JOURNAL OF FRACTURE, 2012, 174 (02) : 163 - 175
  • [29] Dynamic analysis of interfacial crack problems in anisotropic bi-materials by a time-domain BEM
    Lei, Jun
    Garcia-Sanchez, Felipe
    Wuensche, Michael
    Zhang, Chuanzeng
    Wang, Yue-Sheng
    Saez, Andres
    ENGINEERING FRACTURE MECHANICS, 2009, 76 (13) : 1996 - 2010
  • [30] Role of crack length, crack spacing and layer thickness ratio in the electric potential and temperature of thermoelectric bi-materials systems
    Jiang, Dongdong
    Zhou, Yue-Ting
    ENGINEERING FRACTURE MECHANICS, 2022, 259
12345