A Thermal Design Approach for Natural Air Cooled Electronic Equipment Casing

被引：0
|
作者：
Ishizuka, Masaru [1 ]
Hatakeyama, Tomoyuki [1 ]
Kibushi, Risako [1 ]
机构：
[1] Toyama Prefectural Univ, Imizu, Toyama 9390398, Japan
来源：
2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2013年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：67 / 70
页数：4
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