Recent studies on thermal design of fan cooled electronic equipment

被引：0
|
作者：
Fukue, Takashi [1 ]
机构：
[1] Department of Mechanical Engineering, Iwate University, 4-3-5 Ueda, Morioka,Iwate, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2015年 / 18卷 / 02期
关键词：
D O I：
10.5104/jiep.18.86
中图分类号：
学科分类号：
摘要：
16
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页码：86 / 93
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