Thermal and Optical Analysis of Multi-chip LED Packages with Different Electrical Connection and Driving Current

被引：0
|
作者：
Lim, Ming Yeng [1 ]
Gan, Sik Hong [1 ]
Lee, Sze Yen [1 ]
Lee, Zhi Yin [1 ]
Devarajan, Mutharasu [1 ]
机构：
[1] Univ Sains Malaysia, Sch Phys, Nanooptoelect Lab, Minden 11800, Penang, Malaysia
来源：
2012 4TH ASIA SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ASQED) | 2012年
关键词：
Series connection; parallel connection; structure function; thermal resistance; junction temperature rise; thermal transient measurement; optical measurement; POWER;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The junction temperature and the thermal resistance are vital characteristics that will determine the overall performance of LED packages. The influence of two different electrical connections of multi-chip LED packages on the thermal and optical characteristics is discussed in this paper. The thermal and optical characteristics of the LED package are investigated. Measurements are carried out on LED packages with series and parallel connections in sequence. The objective of this study is to compare the thermal and optical performance of the LED packages with different electrical connections. Experimental results revealed that there is a slight variation of 3 to 5% in R-thJA and Delta T-J values between both connections. For both thermal and optical measurements, the results for parallel connection are observed to be better than that for series connection.
引用
收藏
页码：232 / 236
页数：5
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