Automation of the design and development stages of semiconductor devices

The scientific article analyzes the thermal conditions of heat transfer in semiconductor devices, developed a calculation algorithm; a computational methodology for printed circuit boards was chosen, and the proposed methods were implemented by the example of printed circuit boards for calculating the thermal conditions of printed circuit boards that are used to implement power semiconductor technology of oil and gas facilities. It has been established that the automation of design of semiconductor elements and devices involves the initial stages of the thermal calculation in order to optimize the placement of elements and devices to improve the weight and size. It is shown that the analytical approach to the selection of elements and devices allows to reduce the preliminary labor costs for layout, as well as to optimize the placement of elements and devices according to the criterion of minimizing the weight and size indicators. Analysis of transient thermal processes on the printed circuit board can significantly improve the quality of the calculation and obtain more reliable results, bringing them closer to the most reliable.