The fabrication and measurement of a bi-axial thermal convection acceleration sensor

被引：0
|
作者：
Wang, Huan [1 ]
Li, Yigui [1 ]
Yan, Ping [1 ]
Huang, Yuan [1 ]
Sugiyama, Susumu [2 ]
机构：
[1] Shanghai Inst Technol, Sch Sci, Shanghai, Peoples R China
[2] Ritsumeikan Univ, Dept Micro Syst, Kyoto, Japan
来源：
CIVIL, ARCHITECTURE AND ENVIRONMENTAL ENGINEERING, VOLS 1 AND 2 | 2017年
关键词：
D O I：
暂无
中图分类号：
X [环境科学、安全科学];
学科分类号：
08 ; 0830 ;
摘要：
In this paper, a bi-axial (x and y axial) thermal convection acceleration sensor based on MEMS is described. The sensing principal, sensor design, fabrication process and the performance is illustrated. The sensor is fabricated by MEMS process using the SOI wafer. A thermistor with p-type slightly doped silicon beam is fabricated by micro fabrication technology and one end of the beam is fixed and the other end of the beam was free to increase the sensitivity of the sensor because the free end of the beam has a large Temperature Coefficient of Resistance (TCR) value.
引用
收藏
页码：971 / 974
页数：4
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