Design and Measurement of the Plate Laminated Waveguide Slot Array Antenna and Its Feasibility for Wireless Link System in the 120 GHz Band

被引：0
|
作者：
Kim, Dongjin [1 ]
Hirokawa, Jiro [1 ]
Sakurai, Kimio [1 ]
Ando, Makoto [1 ]
Takada, Takuma [2 ]
Nagatsuma, Tadao [2 ]
Takeuchi, Jun [3 ]
Hirata, Akihiko [3 ]
机构：
[1] Tokyo Inst Technol, Dept Elect & Elect Engn, Tokyo 1528552, Japan
[2] Osaka Univ, Grad Sch Engn Sci, Toyonaka, Osaka 5608531, Japan
[3] NTT Corp, NTT Microsyst Integrat Lab, Atsugi, Kanagawa 2430198, Japan
来源：
IEICE TRANSACTIONS ON COMMUNICATIONS | 2013年 / E96B卷 / 08期
关键词：
waveguide antenna; diffusion bonding; full corporate feed; data transmission;
D O I：
10.1587/transcom.E96.8.2102
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We design and fabricate a double-layer hollow-waveguide slot array antenna with wide bandwidth and high antenna efficiency for the 120 GHz band. The antenna is fabricated by diffusion bonding of laminated thin metal plates for high precision and perfect electrical contact. The 16 x 16-element antenna shows more than 70% antenna efficiency over a 13 GHz bandwidth. Furthermore, it realizes error-free data transmission in 2.5 m distance at up to 10 Gbit/g. To our knowledge, this is the first report of the design and fabrication of a high-efficiency wideband planar antenna for the 120 GHz band.
引用
收藏
页码：2102 / 2111
页数：10
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