1D/2D Hybrid Mesh PEEC Solver for the Analysis of Multilayer Planar Circuits

被引：0

作者：

Ahyoune, Saiyd ^{[1
]}

Sieiro, Javier ^{[1
]}

Vidal, Maria N. ^{[1
]}

Lopez-Villegas, Jose M. ^{[1
]}

Ramos, Francisco ^{[2
]}

机构：

[1] Univ Barcelona, Grp Radiofrequencia, Barcelona, Spain

[2] FAE Francisco Albero SAU, Lhospitalet De Llobregat, Spain

来源：

2017 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION FOR RF, MICROWAVE, AND TERAHERTZ APPLICATIONS (NEMO) | 2017年

关键词：

1D mesh; 2D mesh; PEEC; LQS; passives; capacitor; inductor;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

To minimise the number of cells required for analysing numerically a planar circuit, an hybrid meshing technique that combines 1D and 2D cells is presented in this work. Thanks to this discretization procedure of the Partial Element Equivalent Circuit (PEEC) method, the connectivity between 1D and 2D model partitions is made using an unstructured mesh. In this way, it is possible to match regions of the layout with different number of cells at their common interface. The method is applied to the simulation of finger capacitors in a multilayer low temperature co-fired ceramic technology and it is verified with experimental data.

引用

页码：49 / 51

页数：3

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