共 37 条
- [21] Microstructural Stability and Mechanical Properties of Sn-1Ag-0.5Cu Solder Alloy With 0.1 wt.% Al Addition Under High-Temperature Annealing 2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
- [24] The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x = 0, 0.1 and 0.2 wt. %) Journal of Materials Science: Materials in Electronics, 2012, 23 : 1988 - 1997
- [26] The Effect of Sn (0, 0.5, 1 and 3 wt.%) on the Mechanical Properties of Gravity Casting Mg-3Al Alloy and a Neural Network Application for Prediction 3RD INTERNATIONAL ADVANCES IN APPLIED PHYSICS AND MATERIALS SCIENCE CONGRESS, 2013, 1569 : 11 - 14
- [30] Thermal stability and elevated temperature mechanical properties of electroslag remelted Fe-16wt%Al-(0.14-0.5)wt%C intermetallic alloys MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1997, 230 (1-2): : 188 - 193