Branched copper electrodeposition on a substrate

被引：19
|
作者：
Fleury, V [1 ]
Barkey, D [1 ]
机构：
[1] UNIV NEW HAMPSHIRE,DEPT CHEM ENGN,DURHAM,NH 03824
来源：
PHYSICA A | 1996年 / 233卷 / 3-4期
关键词：
D O I：
10.1016/S0378-4371(96)00202-6
中图分类号：
O4 [物理学];
学科分类号：
0702 ;
摘要：
We have investigated electrochemical deposition of copper on a two-dimensional substrate. This method gives almost two-dimensional robust deposits which can be withdrawn from the electrolyte. We present a preliminary study of the morphology as a function of different parameters: current density, cell thickness and substrate anisotropy.
引用
收藏
页码：730 / 741
页数：12
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