Branched copper electrodeposition on a substrate

被引：19

作者：

Fleury, V ^{[1
]}

Barkey, D ^{[1
]}

机构：

[1] UNIV NEW HAMPSHIRE,DEPT CHEM ENGN,DURHAM,NH 03824

来源：

PHYSICA A | 1996年 / 233卷 / 3-4期

关键词：

D O I：

10.1016/S0378-4371(96)00202-6

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

We have investigated electrochemical deposition of copper on a two-dimensional substrate. This method gives almost two-dimensional robust deposits which can be withdrawn from the electrolyte. We present a preliminary study of the morphology as a function of different parameters: current density, cell thickness and substrate anisotropy.

引用

页码：730 / 741

页数：12

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