Measurement of thermal conductivity using TMDSC: Solution to the heat flow problem

被引：13

作者：

Simon, SL ^{[1
]}

McKenna, GB

机构：

[1] Univ Pittsburgh, Dept Chem Engn, Pittsburgh, PA 15261 USA

[2] NIST, Div Polymers, Gaithersburg, MD 20899 USA

来源：

JOURNAL OF REINFORCED PLASTICS AND COMPOSITES | 1999年 / 18卷 / 06期

关键词：

D O I：

10.1177/073168449901800608

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

The dependence of the apparent heat capacity obtained from quasi-isothermal temperature-modulated differential scanning calorimetry (TMD$C) experiments and the thermal conductivity is determined for several cases. The relationships are based on the solution of the heat conduction equation which gives the temperature profile in the TMDSC sample. The temperature profile is then used to calculate the sinusoidal heat flow to the sample. We compare our results with those of other researchers. We also show the effect of thermal contact resistance on the results.

引用

页码：559 / 571

页数：13

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