Color Balancing for Triple Patterning Lithography with Complex Designs

被引:1
|
作者
Tian, Haitong [1 ]
Zhang, Hongbo
Wong, Martin D. F. [1 ]
机构
[1] Univ Illinois, Urbana, IL 61801 USA
来源
PHOTOMASK TECHNOLOGY 2013 | 2013年 / 8880卷
关键词
Color Balancing; Triple Patterning Lithography; Standard Cells;
D O I
10.1117/12.2026285
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
With the minimum feature size keeps shrinking, there are increasing difficulties to print these small features using one exposure (LE) or double exposures (LELE). To resolve the inherent physical limitations for current lithography techniques, triple patterning lithography (LELELE) has been widely recognized as one the most promising options for 14/10nm technology node. For triple patterning lithography (TPL), the designers are more interested in finding a decomposition with none of the three masks overwhelms the other. This color balancing issue is of crucial importance to ensure that consistent and reliable printing qualities can be achieved. In our previous work, 18 a simple color balancing scheme is proposed to handle designed without stitches, which is not capable of handling complex designs with stitches. In this paper, we further extend the previous approach to be able to simultaneously optimizing the number of stitches and balancing the color usage in the three masks. This new approach is very efficient and robust, and guarantees to find a color balancing decomposition while achieving the optimal number of stitches. For the largest benchmark with over 10 million features, experimental results show that the new approach achieves almost perfect color balancing with reasonable runtime.
引用
收藏
页数:8
相关论文
共 50 条
  • [1] Printability Enhancement with Color Balancing for Multiple Patterning Lithography
    Chen, Kuan-Jung
    Fang, Shao-Yun
    IEEE TRANSACTIONS ON EMERGING TOPICS IN COMPUTING, 2019, 7 (02) : 244 - 252
  • [2] Layout Decomposition for Triple Patterning Lithography
    Yu, Bei
    Yuan, Kun
    Zhang, Boyang
    Ding, Duo
    Pan, David Z.
    2011 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2011, : 1 - 8
  • [3] Layout Decomposition for Triple Patterning Lithography
    Yu, Bei
    Yuan, Kun
    Ding, Duo
    Pan, David Z.
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2015, 34 (03) : 433 - 446
  • [4] Triple Patterning Lithography Aware Optimization and Detailed Placement Algorithms for Standard Cell-Based Designs
    Kuang, Jian
    Chow, Wing-Kai
    Young, Evangeline F. Y.
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2016, 24 (04) : 1319 - 1332
  • [5] Hybrid Lithography for Triple Patterning Decomposition and E-Beam Lithography
    Tian, Haitong
    Zhang, Hongbo
    Xiao, Zigang
    Wong, Martin D. F.
    OPTICAL MICROLITHOGRAPHY XXVII, 2014, 9052
  • [6] Detailed Routing Algorithm with Triple Patterning Lithography Constraints
    Xiaoyu L.
    Ruohan S.
    Ning X.
    Yadong Z.
    Jisuanji Fuzhu Sheji Yu Tuxingxue Xuebao/Journal of Computer-Aided Design and Computer Graphics, 2024, 36 (04): : 575 - 581
  • [7] An Efficient Layout Decomposition Approach for Triple Patterning Lithography
    Kuang, Jian
    Young, Evangeline F. Y.
    2013 50TH ACM / EDAC / IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2013,
  • [8] TRIAD: A Triple Patterning Lithography Aware Detailed Router
    Lin, Yen-Hung
    Yu, Bei
    Pan, David Z.
    Li, Yih-Lang
    2012 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2012, : 123 - 129
  • [9] A Novel Layout Decomposition Algorithm for Triple Patterning Lithography
    Fang, Shao-Yun
    Chang, Yao-Wen
    Chen, Wei-Yu
    2012 49TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2012, : 1181 - 1186
  • [10] A Novel Layout Decomposition Algorithm for Triple Patterning Lithography
    Fang, Shao-Yun
    Chang, Yao-Wen
    Chen, Wei-Yu
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2014, 33 (03) : 397 - 408