200 kVA Compact IGBT Modules with Double-Sided Cooling for HEV and EV

被引：0

作者：

Chang, Hsueh-Rong ^{[1
]}

Bu, Jiankang ^{[1
]}

Hauenstein, Henning ^{[1
]}

Wittmann, Michael ^{[1
]}

Marcinkowski, Jack ^{[1
]}

Pavier, Mark ^{[2
]}

Palmer, Scott ^{[2
]}

Tompkins, Jim ^{[3
]}

机构：

[1] Int Rectifier Corp, Automot Prod Business Unit, 101 N Sepulveda Blvd, El Segundo, CA 90245 USA

[2] Int Rectifier Corp, Adv Packaging, El Segundo, CA 90245 USA

[3] Int Rectifier Corp, Elect Mot Syst, El Segundo, CA 90245 USA

来源：

2012 24TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD) | 2012年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

High power compact IGBT half bridge modules with a current rating of 300A and a blocking voltage of 650V using ultra thin IGBTs and diodes have been successfully developed with double-sided cooling capability. The wirebond-less package building block called (COOLiRDIE)-D-2 (TM) has a small area of 28.5 mm x 16 mm with a power rating 200 kVA, This is the most compact IGBT package reported today. A low on-state voltage of 1.6V at 300A is achieved in the wirebond-less package. The combination of lower on-state voltage and larger heat exchange area due to the solderable front metal (SFM), increases the IGBT module current carrying capability by 30%.

引用

页码：299 / 302

页数：4

共 50 条

[31] Compact Corrugated Plate for Double-Sided Contactless Waveguide Flange
Sun, Dongquan
Chen, Xiang
Guo, Lixin
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021, 31 (02) : 129 - 132
[32] Modeling of SiC Power Modules with Double Sided Cooling
Brinkfeldt, Klas
Neumaier, Klaus
Mann, Alexander
Zschieschang, Olaf
Otto, Alexander
Kaulfersch, Eberhard
Edwards, Michael
Andersson, Dag
2014 15TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2014,
[33] Development of new power mosfets package with double-sided cooling
Ashida, Kisho
Muto, Akira
Shimizu, Ichio
Kawano, Kenya
Tanaka, Naotaka
Yoneda, Nae
IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 1, 2007, : 423 - 427
[34] Double-sided IPEM cooling using miniature heat pipes
Martens, TJ
Nellis, GF
Pfotenhauer, JM
Jahns, TM
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (04): : 852 - 861
[35] A New High Capacity Compact Power Modules for high power EV/HEV inverters
Inokuchi, Seiichiro
Saito, Shoji
Izuka, Arata
Hata, Yuki
Hatae, Shinji
Nakano, Toshiya
Motto, Eric R.
APEC 2016 31ST ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, 2016, : 468 - 471
[36] A Novel Double-Sided Cooling Inverter Leg for High Power Density EV Based on Customized SiC Power Module
Liu, Xinmin
Yan, Yiyang
Chen, Cai
Wu, Zongheng
Kang, Yong
2020 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2020, : 3151 - 3154
[37] Low-Inductance Double-Sided Cooling Power Module with Branched Lead Frame Terminals for EV Traction Inverter
Tokuyama, Takeshi
Mima, Akira
Takagi, Yusuke
Matsushita, Akira
2020 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2020, : 3987 - 3991
[38] Defect Detection in Double-Sided Cooled Power Modules by Structure Functions
Scognamillo, Ciro
Catalano, Antonio Pio
D'Alessandro, Vincenzo
Codecasa, Lorenzo
Castellazzi, Alberto
PRIME 2022: 17TH INTERNATIONAL CONFERENCE ON PHD RESEARCH IN MICROELECTRONICS AND ELECTRONICS, 2022, : 81 - 84
[39] Online Junction Temperature Measurement of Double-sided Cooling IGBT Power Module through On-state Voltage with High Current
Chai, Xiaoguang
Ning, Puqi
Cao, Han
Zheng, Dan
Li, Huakang
Huang, Yunhao
Kang, Yuhui
CHINESE JOURNAL OF ELECTRICAL ENGINEERING, 2022, 8 (04): : 104 - 112
[40] Heat Dissipating Structure Design of an Inverter with Direct-cooling IGBT Modules for EV
Sun Wei
Liu Jun
Su Wei
Gong Xuegeng
2014 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO (ITEC) ASIA-PACIFIC 2014, 2014,

← 1 2 3 4 5 →