SIMULATION OF IC-PACKAGES FOR RF AND MW APPLICATIONS

被引：0
|
作者：
Chukov, G., V [1 ]
Nazarova, G. N. [1 ]
Yu, Nikiforov A. [1 ]
机构：
[1] Natl Res Nucl Univ, Moscow Engn Phys Inst, 31 Kashirskoye Highway, Moscow 115409, Russia
来源：
2014 24TH INTERNATIONAL CRIMEAN CONFERENCE MICROWAVE & TELECOMMUNICATION TECHNOLOGY (CRIMICO) | 2014年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new approach to characterization of IC-packages for RF and microwave applications based on electromagnetic simulation and vector measurements is presented. Following the approach the equivalent-circuit parameters and maximum working frequency have been evaluated for a variety of metal-ceramic and metal-glass packages produced domestically.
引用
收藏
页码：131 / 132
页数：2
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