MEMS monolithic integration technology

被引：1
|
作者：
Zhang Zhao-yun [1 ]
Shi Zhi-gui [1 ]
Yang Zhen-chuan [2 ]
Peng Bo [1 ]
机构：
[1] China Acad Engn Phys, Inst Elect Engn, Mianyang 621900, Peoples R China
[2] Peking Univ, Natl Key Lab Micro Nano Fabricat Technol, Beijing 100871, Peoples R China
来源：
MICRO-NANO TECHNOLOGY XIV, PTS 1-4 | 2013年 / 562-565卷
关键词：
MEMS; Monolithic integration; Surface micromachining; Bulk micromachining; CMOS;
D O I：
10.4028/www.scientific.net/KEM.562-565.1387
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The monolithic integrated technology of MEMS was discussed. First discussed the advantages and difficulties faced by the MEMS monolithic integration technology. Second the features and the process of the mainstream MEMS monolithic integration technology was introduced. And finally put forward a SOI MEMS monolithic integration technology, the technology with no high-temperature process, Post-CMOS integrated solution, compatible with the CMOS process. This technology can achieve high aspect ratio, high-performance micro-inertial devices..
引用
收藏
页码：1387 / +
页数：3
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