Glass composition for the thick-film resistors

被引:3
|
作者
Setina, J
Akishin, V
Vaivads, J
机构
[1] Riga Tech Univ, LV-1048 Riga, Latvia
[2] Joint Stock Co, LV-4200 Valmiera, Latvia
关键词
phosphate glasses; application; thick-film hybrid circuits; lead-free; thick-film inks; thick-film resistors;
D O I
10.4028/www.scientific.net/MSF.502.231
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The considerable part of thick-film inks (TFI) for the production of hybrid circuits using screen-printing technology is glass. Phosphate glasses for production of thick-film resistors (TFR), which can substitute now currently used lead borosilicate glasses, have been investigated. The TFI were produced from glass and RuO2 by the addition of the screening agent and vehicle and deposited on an alumina substrate Rubalit (R) 708. Phosphate glasses have suitable thermal and chemical properties for the formation of high-quality coating on alumina with a high electrical resistivity, sufficient chemical durability and viscosity-temperature relationship suitable for TFI A complete saturation of RuO2-film with the glass phase without chemical interaction between glass-RuO2 and glass-alumina substrate was found at sintering temperature 850(0)C. The film near the substrate has a low content of Ru and a high content of Al owing to diffusion of Al from the substrate. Owing to suitable properties the investigated phosphate glasses are convenient to be applied in the production of RuO2 based TFR by printing on alumina.
引用
收藏
页码:231 / 236
页数:6
相关论文
共 50 条
  • [21] LASER TRIMMING OF THICK-FILM RESISTORS AND NEW COMPOSITIONS FOR THICK-FILM CIRCUITS
    KAMECKE, W
    INTERNATIONALE ELEKTRONISCHE RUNDSCHAU, 1973, 27 (03): : 63 - 66
  • [22] Piezoresistive anisotropy of thick-film resistors
    Grimaldi, C
    Ryser, P
    Strässler, S
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2004, 24 (06) : 1893 - 1896
  • [23] STRAIN SENSITIVITY IN THICK-FILM RESISTORS
    CANALI, C
    MALAVASI, D
    MORTEN, B
    PRUDENZIATI, M
    TARONI, A
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (03): : 421 - 423
  • [24] A NEW MODEL FOR THICK-FILM RESISTORS
    CHEN, YL
    HARMER, MP
    AMERICAN CERAMIC SOCIETY BULLETIN, 1992, 71 (08): : 1172 - 1172
  • [25] THIN GLASS-FILM BETWEEN ULTRAFINE CONDUCTOR PARTICLES IN THICK-FILM RESISTORS
    CHIANG, YM
    SILVERMAN, LA
    FRENCH, RH
    CANNON, RM
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1994, 77 (05) : 1143 - 1152
  • [26] THICK-FILM RESISTORS WITH IMPROVED VOLTAGE STABILITY
    TAKETA, Y
    HARADOME, M
    IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (01): : 74 - 81
  • [27] ELECTRICAL TRANSPORT IN THICK-FILM (CERMET) RESISTORS
    PRUDENZIATI, M
    ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1983, 10 (04): : 285 - 293
  • [28] THERMAL-DEGRADATION OF THICK-FILM RESISTORS
    NORDSTROM, TV
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (03) : C95 - C95
  • [29] STABILITY AND DETERIORATION MECHANISM OF THICK-FILM RESISTORS
    TAKETA, Y
    HARADOME, M
    MICROELECTRONICS AND RELIABILITY, 1974, 13 (04): : 281 - 289
  • [30] THICK-FILM FAIL-SAFE RESISTORS
    NOWAK, S
    WOJCICKA, DL
    ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1983, 10 (04): : 255 - 260