Plastics - the future of electronics in packaging?

被引：0

作者：

Butler, M ^{[1
]}

机构：

[1] Univ Sheffield, Ctr Polymer, Sheffield S3 7HF, S Yorkshire, England

来源：

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D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：22 / 23

页数：2

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