Research on Moulding Process and Dielectric Property of Polyimide Foam

被引：3

作者：

Qi, Kailiang ^{[1
]}

Zhang, Guangcheng ^{[1
]}

机构：

[1] Northwestern Polytech Univ, Sch Nat & Appl Sci, Dept Appl Chem, Xian 710129, Peoples R China

来源：

PROGRESS IN POLYMER PROCESSING | 2012年 / 501卷

关键词：

polyimide; moulding process; cellular structure; dielectric property; MICROSCALE; DRAINAGE;

D O I：

10.4028/www.scientific.net/KEM.501.215

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Foaming moulding process, cellular structure and dielectric property of polyimide (PI) foam which has been prepared by esterification method were discussed. Research results showed that the cell of prepared PI foam was well-distributed and its pore volume and porosity were bigger by microwave heating when methanol was used as the foaming agent and its content in the polyester ammonium salt (PEAS) precursor powder was 13-15%; meanwhile, the dielectric constant and loss factor of PI foam were lower.

引用

页码：215 / 219

页数：5

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