The effect of curing agent on the properties of silver paste electrically conductive adhesives(ECAs)

被引:0
|
作者
Hao, Jian [1 ]
He, Xinyue [1 ]
Li, Saipeng [1 ]
Zhou, Jian [1 ]
Xue, Feng [1 ]
机构
[1] Southeast Univ, Sch Mat Sci & Engn, Nanjing 211189, Jiangsu, Peoples R China
关键词
Silver Paste ECAs; Curing agent; Shear strength; Volume resistivity; Curing loss rate;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The Electrically Conductive Adhesives(ECAs) has better printing performance than the solder paste, which can meet the requirements of higher precision. In this paper, three different kinds of organic matter were used as curing agents in an ECAs to find out the effect on that. The effect of curing agent on the conductive properties of silver paste ECAs has been systematically investigated by volume resistivity test, and the curing loss rate was used to indicate the curing properties. In addition, the mechanical properties on different curing time were analyzed by comparing the shear stress through shear strength test. The analysis of volume resistivity test indicated that extension curing time will make the unevenness of silver particle become larger, which can benefit the conductivity of silver paste ECAs. Whats more, and the result of shear strength tests show that when curing time up to 20 minutes, the shear strength of containing triethanolamine and dicyandiamide silver paste ECAs will be more than 10MPa when curing time up to 20 minutes. The curing loss rate indicate that the silver paste ECAs which contains triethanolamine is the most stable one.
引用
收藏
页码:644 / 648
页数:5
相关论文
共 50 条
  • [1] Investigation of properties and curing process of silver paste electrically conductive adhesives (ECAs)
    Li, Saipeng
    He, Xinyue
    Hao, Jian
    Zhou, Jian
    Xue, Feng
    Zhou, Jian
    Xue, Feng
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 275 - 279
  • [2] Processing and shape effects on silver paste electrically conductive adhesives (ECAs)
    Chiang, HW
    Chung, CL
    Chen, LC
    Li, Y
    Wong, CP
    Fu, SL
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2005, 19 (07) : 565 - 578
  • [3] Processing and shape effects on silver paste electrically conductive adhesives (ECAs)
    Chung, C.-L. (markchun@isu.edu.tw), 1600, VSP BV (19):
  • [4] The effect of conductive filler on the properties of electrically conductive adhesives(ECAs)
    Hao, Jian
    Wang, Dapeng
    Li, Saipeng
    He, Xinyue
    Zhou, Jian
    Xue, Feng
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 803 - 808
  • [5] Jet printing morphology and rheological characteristics of silver paste electrically conductive adhesives (ECAs)
    Li, Saipeng
    Wang, Dapeng
    Zhou, Jian
    Xue, Feng
    He, Xinyue
    Zhou, Jian
    Xue, Feng
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 271 - 274
  • [6] Fundamental study of electrically conductive adhesives (ECAs)
    Wong, CP
    Lu, DQ
    Meyers, L
    Vona, SA
    Tong, QK
    PEP '97 : THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING - PROCEEDINGS, 1997, : 80 - 85
  • [7] Electrical characterizations and considerations of electrically conductive adhesives (ECAs)
    Shimada, Y
    Lu, DQ
    Wong, CP
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 336 - 342
  • [8] Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes
    Li, Yi
    Moon, Kyoung-Sik
    Whitman, Andrew
    Wong, C. P.
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (04): : 758 - 763
  • [9] An overview of the use of electrically conductive adhesives (ECAs) as a solder replacement
    Lewis, H. J.
    Coughlan, F. M.
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2008, 22 (8-9) : 801 - 813
  • [10] Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
    Yim, Byung-Seung
    Kwon, Yumi
    Oh, Seung Hoon
    Kim, Jooheon
    Shin, Yong-Eui
    Lee, Seong Hyuk
    Kim, Jong-Min
    MICROELECTRONICS RELIABILITY, 2012, 52 (06) : 1165 - 1173