Towards 3D optical integration by micro-transfer printing of ultra-thin membrane devices

被引:0
|
作者
McPhillimy, John [1 ]
Klitis, Charalambos [2 ]
Hill, Paul [1 ]
May, Stuart [2 ]
Guilhabert, Benoit [1 ]
Dawson, Martin D. [1 ]
Sorel, Marc [2 ]
Strain, Michael J. [1 ]
机构
[1] Univ Strathclyde, Dept Phys, Inst Photon, Glasgow, Lanark, Scotland
[2] Univ Glasgow, Sch Engn, Glasgow, Lanark, Scotland
基金
英国工程与自然科学研究理事会;
关键词
Photonic integrated circuits; hybrid integration; transfer printing; silicon photonics; diamond; III-V semiconductors;
D O I
暂无
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Transfer printing is a micro-assembly technique that has been used to demonstrate hybrid material device integration using membranes, typically of a few microns in thickness. In order to target full 3D integration of integrated photonic devices, here we present the fabrication and printing of membranes with dimensions down to 10's of nanometres. Both sacrificial layer etching and assembly of free standing platelets onto support substrates have been developed to allow membrane formation across a range of material platforms. Devices are successfully printed onto host substrates, showing a high degree of mechanical flexibility and conformation over existing surface features. Multi-layer printing of membranes shows a route towards micro-assembly of hybrid material 3D photonics.
引用
收藏
页码:124 / 127
页数:4
相关论文
共 50 条
  • [31] Study of 3D printing method for GRIN micro-optics devices
    Wang, P. J.
    Yeh, J. A.
    Hsu, W. Y.
    Cheng, Y. C.
    Lee, W.
    Wu, N. H.
    Wu, C. Y.
    [J]. ADVANCED FABRICATION TECHNOLOGIES FOR MICRO/NANO OPTICS AND PHOTONICS IX, 2016, 9759
  • [32] Assessment of ultra-thin Si wafer thickness in 3D wafer stacking
    Kim, Eun-Kyung
    [J]. MICROELECTRONICS RELIABILITY, 2010, 50 (02) : 195 - 198
  • [33] Sintering behavior of ultra-thin 3D printed alumina lattice structures
    Maniere, Charles
    Harnois, Christelle
    Marinel, Sylvain
    [J]. ACTA MATERIALIA, 2023, 250
  • [34] A Novel 3D IC Assembly Process for Ultra-Thin Chip Stacking
    Lin, Yu-Min
    Zhan, Chau-Jie
    Hsiao, Zhi-Cheng
    Fu, Huan-Chun
    Cheng, Ren-Shin
    Huang, Yu-Wei
    Huang, Shin-Yi
    Chen, Su-Mei
    Fan, Chia-Wen
    Chien, Chun-Hsien
    Ko, Cheng-Ta
    Guo, Yu-Huan
    Lee, Chang-Chun
    Tsutsumi, Yoshihiro
    Woo, Junsoo
    Suzuki, Yoshikazu
    Sato, Yusuke
    Liu, Chien-Ting
    Chao, Chih-Heng
    [J]. 2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 470 - 474
  • [35] Innovative Method for Automatic Shape Generation and 3D Printing of Reduced-Scale Models of Ultra-Thin Concrete Shells
    Tome, Ana
    Vizotto, Isaias
    Valenca, Jonatas
    Julio, Eduardo
    [J]. INFRASTRUCTURES, 2018, 3 (01)
  • [36] 3D printing of ultra-thin veneers made of lithium disilicate using the LCM method in a digital workflow: A feasibility study
    Schweiger, J.
    Edelhoff, D.
    Schubert, O.
    [J]. JOURNAL OF ESTHETIC AND RESTORATIVE DENTISTRY, 2024, 36 (04) : 588 - 594
  • [37] 3D printing path planning algorithm for thin walled and complex devices
    Yang, Min
    Lai, Menggang
    Liu, Shengjun
    [J]. SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS, 2021, 28 (01) : 327 - 334
  • [38] Integration and fabrication of the cheap ceramic membrane through 3D printing technology
    Hwa, Lim Chin
    Uday, M. B.
    Ahmad, Norhayati
    Noor, Alias Mohd
    Rajoo, Srithar
    Bin Zakaria, Khidzir
    [J]. MATERIALS TODAY COMMUNICATIONS, 2018, 15 : 134 - 142
  • [39] Glass 3D printing for ultra-miniaturized endoscopic optical systems
    Kretschmer, Simon
    Ataman, Caglar
    Zappe, Hans
    [J]. 2019 24TH MICROOPTICS CONFERENCE (MOC), 2019, : 76 - 77
  • [40] Printed Optics: 3D Printing of Embedded Optical Elements for Interactive Devices
    Willis, Karl D. D.
    Brockmeyer, Eric
    Hudson, Scott
    Poupyrev, Ivan
    [J]. UIST'12: PROCEEDINGS OF THE 25TH ANNUAL ACM SYMPOSIUM ON USER INTERFACE SOFTWARE AND TECHNOLOGY, 2012, : 589 - 598