Hygrothermal Analysis for the Electrochemical Migration Failure in Multi-Chip Packages during a Highly Accelerated Stress Test

被引：0

作者：

Choe, Jongguk ^{[1
]}

Jang, Jae-Won ^{[1
]}

Kim, Nam-Seog ^{[2
]}

Lee, Soon-Bok ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Mech Engn, 373-1 Guseong Dong, Taejon 305701, South Korea

[2] SK Hynix Inc, Icheon, Gyeonggido, South Korea

来源：

14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) | 2012年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, as one of the failure modes of electronics packages, electrochemical migration failure of a multi-chip package is addressed. Two types of multi-chip packages which consist of an encapsulated molding compound, two chips, a spacer, adhesives, and a substrate, are investigated. The hygroscopic properties of these materials are measured and the moisture concentrations of the spacers are investigated by a finite element analysis. It was concluded that adhesive under the top chip severely degrades the reliability of the package.

引用

页数：4

共 29 条

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