共 50 条
- [41] Thermo-mechanical characterization of copper through-wafer interconnects 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 844 - +
- [42] Thermo-mechanical characterization of fumed silica-epoxy nanocomposites POLYMER, 2005, 46 (26) : 12065 - 12072
- [43] Flow characterization and thermo-mechanical response of anisotropic conductive films IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (02): : 177 - 185
- [46] Thermo-mechanical characterization of shape memory alloy torque tubes SMART STRUCTURES AND MATERIALS 1999: SMART MATERIALS TECHNOLOGIES, 1999, 3675 : 295 - 302
- [49] Flow characterization and thermo-mechanical response of anisotropic conductive films 3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, : 68 - 75