Influence of flip-chip assembly on on-chip spiral inductor

被引：0
|
作者：
Itoh, N [1 ]
Nagata, M [1 ]
Yoshitomi, S [1 ]
机构：
[1] Toshiba Co Ltd, Semicond Co, Sakae Ku, Yokohama, Kanagawa 2478585, Japan
来源：
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING | 2004年 / 14卷 / 03期
关键词：
flip-chip assembly; VCO; electromagnetic simulation; spiral inductor; mutual inductance;
D O I：
10.1002/mmce.20007
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
The influence of flip-chip assembly on a 2.4-GHz fully integrated Voltage Controlled Oscillator (VCO) is studied. Oscillation frequency and phase noise differ by 17.7% and 9.4 dB, respectively, between flip-chip assembly and package. Measurement and simulation are compared and show excellent agreement. Mutual inductance is found to be the origin of the degradation of the inductor's characteristics. (C) 2004 Wiley Periodicals, Inc.
引用
收藏
页码：236 / 243
页数：8
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