PECVD low-permittivity organosilicate glass coatings: Adhesion, fracture and mechanical properties

被引：50

作者：

Lin, Youbo ^{[1
]}

Xiang, Yong ^{[1
]}

Tsui, Ting Y. ^{[2
]}

Vlassak, Joost J. ^{[1
]}

机构：

[1] Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

[2] Univ Waterloo, Dept Chem Engn, Nanotechnol Inst, Waterloo, ON N2L 3G1, Canada

来源：

ACTA MATERIALIA | 2008年 / 56卷 / 17期

关键词：

Low-permittivity; Organosilicate glass; Thin film; Mechanical properties; Fracture;

D O I：

10.1016/j.actamat.2008.06.007

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The structure and mechanical behavior of organosilicate glass (OSG) coatings have been analyzed as a function of composition and UV irradiation time. A decrease in the OSG carbon content results in more networking bonds and increased connectivity UV irradiation increases the connectivity by severing weak terminal bonds and stabilizes the network through local bond rearrangements. These structure modifications lead to a significant improvement in the stiffness, hardness, and fracture energy of these coatings. The networking bond density and mean connectivity number correlate well with the mechanical behavior of the OSG films, although network bond density weighted by bond energy is a more appropriate measure. The adhesion energy of silicon nitride to OSG is significantly higher than the cohesive energy of the OSG as a result of interface densification and crack-tip shielding. Subcritical fracture measurements in aqueous environments show that the detrimental effect of water on adhesion Surpasses the effect of network connectivity. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：4932 / 4943

页数：12

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