Current and future uses of gold in electronics

被引:124
|
作者
Goodman, P [1 ]
机构
[1] ERA Technol Ltd, Surrey KT22 7SA, England
关键词
PCBs; Contact Resistance; Print Circuit Board; Wire Bond; Gold Alloy;
D O I
10.1007/BF03214833
中图分类号
O61 [无机化学];
学科分类号
070301 ; 081704 ;
摘要
The applications for gold in electrical and electronic components are many and varied, and the quantity used is growing steadily especially with the growth in consumer electrical and electronic goods. This paper considers the various applications in the context of the physical and chemical properties of gold relative to other candidate materials. The question of reliability versus cost inevitably enters into the decision to use gold in a particular application, but the use of gold is widespread nevertheless, since it is often cost effective.
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页码:21 / 26
页数:6
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