Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology

A flexible printed circuit board (FPCB) is flexible, thin and lightweight; however, FPCBs experience more deflection and stress in the flow environment because of fluid-structure interaction (FSI), which affects their performance. Therefore, the present study focuses to optimize a typical FPCB electronic in order to minimize the deflection and stress induced in the system. In this study, numeric parameters (i.e., flow velocity, component size, component thickness, misalignment angle, as well as the length and width of the FPCB) were optimized using response surface methodology (RSM) with the central composite design technique. The separate effects of the independent variables and their interactions were investigated. The optimized condition was also examined to substantiate the empirical models generated using RSM. At a flow velocity of 5 m/s, the optimum values of the component size, component thickness, misalignment angle, as well as the length and width of the FPCB were determined at 11.69 mm, 12.37 mm, -0.73 degrees, as well as 180 mm and 180 mm, respectively. This optimized condition resulted in a maximum deflection of 0.402 mm and a maximum stress of 0.582 MPa. The findings conveyed can contribute to the development of FPCB industries. (C) 2013 Elsevier Ltd. All rights reserved.