The effects of hydrogen bonds on the adhesion of inorganic oxide particles on hydrophilic silicon surfaces

被引：53
|
作者：
Wu, X [1 ]
Sacher, E [1 ]
Meunier, M [1 ]
机构：
[1] Ecole Polytech, Dept Genie Phys, Grp Rech Phys & Technol Couches Minces, Montreal, PQ H3C 3A7, Canada
来源：
JOURNAL OF APPLIED PHYSICS | 1999年 / 86卷 / 03期
关键词：
D O I：
10.1063/1.370956
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
Hydrogen bonds have a dominant effect on the adhesion of inorganic oxide particles, such as SiO(2) and Al(2)O(3), to hydrophilic silicon surfaces. An analysis of adhesion forces due to hydrogen bonds between particle and substrate surfaces has been carried out, and is used to interpret the efficiencies of removing polystyrene latex, SiO(2), and Al(2)O(3) particles from a hydrophilic silicon surface by laser cleaning. Evidence of the dominant effect of hydrogen bonding was confirmed by using alcohol instead of water during particle deposition. (C) 1999 American Institute of Physics. [S0021-8979(99)06415-4].
引用
收藏
页码：1744 / 1748
页数：5
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