Three-dimensional lattice matching of epitaxially embedded nanoparticles

被引:1
|
作者
May, Brelon J. [1 ]
Anderson, Peter M. [1 ]
Myers, Roberto C. [1 ,2 ]
机构
[1] Ohio State Univ, Dept Mat Sci & Engn, Columbus, OH 43210 USA
[2] Ohio State Univ, Dept Elect & Comp Engn, Columbus, OH 43210 USA
关键词
Low dimensional structures; Epitaxy; Defects; PYRAMIDAL QUANTUM DOTS; FINITE-ELEMENT-ANALYSIS; ELLIPSOIDAL INCLUSION; STRAIN DISTRIBUTIONS; ELECTRONIC-STRUCTURE; MISFIT DISLOCATIONS; ELASTIC FIELDS; HALF-SPACE; RELAXATION; POLYHEDRA;
D O I
10.1016/j.jcrysgro.2016.11.042
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
For a given degree of in-plane lattice mismatch between a two-dimensional (2D) epitaxial layer and a substrate (epsilon*(IP)) there is a critical thickness above which interfacial defects form to relax the elastic strain energy. Here, we extend the 2D lattice-matching conditions to three-dimensions in order to predict the critical size beyond which epitaxially encased nanoparticles, characterized by both epsilon*(IP) and out-of-plane lattice mismatch (epsilon*(IP)), relax by dislocation formation. The critical particle length (L-c) at which defect formation proceeds is determined by balancing the reduction in elastic energy associated with dislocation introduction with the corresponding increase in defect energy. Our results, which use a modified Eshelby inclusion technique for an embedded, arbitrarily-faceted nanoparticle, provide new insight to the nanoepitaxy of low dimensional structures, especially quantum dots and nanoprecipitates. By engineering epsilon*(IP) and epsilon*(OP), the predi(c)ted L-c for nanoparticles can be increased to well beyond the case of encapsulation in a homogenous matrix. For the case of truncated pyramidal shaped InAs, L-c similar to 10.8 nm when fully embedded in GaAs (epsilon*(IP) = epsilon*(OP) =-0.072); 16.4 nm when the particle is grown on GaAs, but capped with InSb (epsilon*(IP) =-0.072 and epsilon*(OP)= 0.065); and a maximum of 18.4 nm if capped with an alloy corresponding to epsilon*(OP)=+0.037. The effect, which we term "3D Poisson-stabilization" provides a means to increase the epitaxial strain tolerance in epitaxial heterostructures by tailoring epsilon*(OP).
引用
收藏
页码:209 / 214
页数:6
相关论文
共 50 条
  • [41] The lattice discrepancy of certain three-dimensional bodies
    Kraetzel, Ekkehard
    Nowak, Werner Georg
    MONATSHEFTE FUR MATHEMATIK, 2011, 163 (02): : 149 - 174
  • [42] Transport properties of the three-dimensional Penrose lattice
    Arai, Y.
    Ishii, Y.
    Journal of Alloys and Compounds, 2002, 342 (1-2): : 374 - 376
  • [43] The lattice discrepancy of certain three-dimensional bodies
    Ekkehard Krätzel
    Werner Georg Nowak
    Monatshefte für Mathematik, 2011, 163 : 149 - 174
  • [44] Three-dimensional lattice Boltzmann model for electrodynamics
    Mendoza, M.
    Munoz, J. D.
    PHYSICAL REVIEW E, 2010, 82 (05):
  • [45] Transport properties of the three-dimensional Penrose lattice
    Arai, Y
    Ishii, Y
    JOURNAL OF ALLOYS AND COMPOUNDS, 2002, 342 (1-2) : 374 - 376
  • [46] A three-dimensional unilateral autoregressive lattice process
    Martin, RJ
    JOURNAL OF STATISTICAL PLANNING AND INFERENCE, 1997, 59 (01) : 1 - 18
  • [47] Simulating photons and plasmons in a three-dimensional lattice
    Pletzer, A
    Shvets, G
    PHYSICA B-CONDENSED MATTER, 2003, 338 (1-4) : 190 - 195
  • [48] Waves in three-dimensional simple cubic lattice
    Wang, Xiao-yun
    Duan, Wen-shan
    Lin, Mai-mai
    Wan, Gui-xin
    CHAOS SOLITONS & FRACTALS, 2006, 30 (04) : 909 - 919
  • [49] Brittle fracture of three-dimensional lattice structure
    Gu, Huaiyuan
    Shterenlikht, Anton
    Pavier, Martyn
    ENGINEERING FRACTURE MECHANICS, 2019, 219
  • [50] Constructing of three-dimensional molybdenum carbide nanoparticles embedded in honeycomb carbon as efficient microwave absorbers
    Yang, Xiao
    Qiang, Rong
    Shao, Yulong
    Xue, Rui
    Wu, Xu
    Zhang, Yiheng
    Ren, Fangjie
    Ding, Yuancheng
    Niu, Weihao
    Ma, Qian
    Wang, Yahui
    JOURNAL OF ALLOYS AND COMPOUNDS, 2024, 1004