Highly-Integrated Scalable D-band Receiver Front-End Modules in a 130 nm SiGe Technology for Imaging and Radar Applications

被引:0
|
作者
Aguilar, Erick [1 ]
Issakov, Vadim [2 ]
Weigel, Robert [1 ]
机构
[1] Univ Erlangen Nurnberg, Inst Tech Elect, D-90132 Erlangen, Germany
[2] Univ Magdeburg, Magdeburg, Germany
关键词
mm-wave; SiGe; receiver; imaging; radar;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Two-highly integrated, scalable D-Band receiver front-ends based on active and passive baluns which integrate a D-Band signal generator developed in a 130 nm SiGe technology are presented. The presented circuits exhibit a wide tuning range of 19 GHz around 110 GHz and achieve high conversion gains >20 dB and >12 dB for the active-based an passive-based approaches correspondingly. The new chips offer robust solutions for high-gain or high-linearity receivers while showing an extremely compact form factor. Both chips show competitive performance compared with state-of-the-art solutions. Due to their highly reduced area without compromising the power consumption, they can be directly integrated into high-density sensor arrays for imaging and radar applications.
引用
收藏
页码:68 / 71
页数:4
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