System-on-Chip Considerations for Heterogeneous Integration of CMOS and Fluidic Bio-Interfaces

被引:20
|
作者
Datta-Chaudhuri, Timir [1 ,2 ]
Smela, Elisabeth [2 ,3 ]
Abshire, Pamela A. [1 ,2 ]
机构
[1] Univ Maryland, Dept Elect & Comp Engn, College Pk, MD 20740 USA
[2] Univ Maryland, Syst Res Inst, College Pk, MD 20740 USA
[3] Univ Maryland, Dept Mech Engn, College Pk, MD 20740 USA
基金
美国国家科学基金会;
关键词
Biosensor; heterogeneous integration; lab-on-a-chip; lab-on-CMOS; microfluidics; system on a chip; MICROELECTRODE ARRAY; CELL-CULTURE; IN-VITRO; ELECTRODE ARRAY; CONTACT IMAGER; SHEAR-STRESS; LAB; TEMPERATURE; SENSOR; MICROFLUIDICS;
D O I
10.1109/TBCAS.2016.2522402
中图分类号
R318 [生物医学工程];
学科分类号
0831 ;
摘要
CMOS chips are increasingly used for direct sensing and interfacing with fluidic and biological systems. While many biosensing systems have successfully combined CMOS chips for readout and signal processing with passive sensing arrays, systems that co-locate sensing with active circuits on a single chip offer significant advantages in size and performance but increase the complexity of multi-domain design and heterogeneous integration. This emerging class of lab-on-CMOS systems also poses distinct and vexing technical challenges that arise from the disparate requirements of biosensors and integrated circuits (ICs). Modeling these systems must address not only circuit design, but also the behavior of biological components on the surface of the IC and any physical structures. Existing tools do not support the cross-domain simulation of heterogeneous lab-on-CMOS systems, so we recommend a two-step modeling approach: using circuit simulation to inform physics-based simulation, and vice versa. We review the primary lab-on-CMOS implementation challenges and discuss practical approaches to overcome them. Issues include new versions of classical challenges in system-on-chip integration, such as thermal effects, floor-planning, and signal coupling, as well as new challenges that are specifically attributable to biological and fluidic domains, such as electrochemical effects, non-standard packaging, surface treatments, sterilization, microfabrication of surface structures, and microfluidic integration. We describe these concerns as they arise in lab-on-CMOS systems and discuss solutions that have been experimentally demonstrated.
引用
收藏
页码:1129 / 1142
页数:14
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